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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    20-3518-11H

    20-3518-11H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    0
    RFQ
    20-3518-11H

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICA-316-ZWGT-2

    ICA-316-ZWGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-316-ZWGT-2

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    19-0517-90C

    19-0517-90C

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    0
    RFQ
    19-0517-90C

    Datasheet

    0517 Bulk Active SIP 19 (1 x 19) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICA-422-SGG

    ICA-422-SGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-422-SGG

    Datasheet

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-422-SGG

    ICO-422-SGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-422-SGG

    Datasheet

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    110-11-304-41-001000

    110-11-304-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    110-11-304-41-001000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0115-T-11

    HLS-0115-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0115-T-11

    Datasheet

    HLS Tube Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    24-4518-10M

    24-4518-10M

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    0
    RFQ
    24-4518-10M

    Datasheet

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-3518-101

    28-3518-101

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    RFQ
    28-3518-101

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6518-101

    28-6518-101

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    RFQ
    28-6518-101

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-2823-90C

    08-2823-90C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-2823-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    05-0501-21

    05-0501-21

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    0
    RFQ
    05-0501-21

    Datasheet

    501 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    05-0501-31

    05-0501-31

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    0
    RFQ
    05-0501-31

    Datasheet

    501 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0118-T-11

    HLS-0118-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0118-T-11

    Datasheet

    HLS Tube Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICO-308-BGG

    ICO-308-BGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-308-BGG

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    346-93-122-41-013000

    346-93-122-41-013000

    CONN SOCKET SIP 22POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    346-93-122-41-013000

    Datasheet

    346 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-122-41-013000

    346-43-122-41-013000

    CONN SOCKET SIP 22POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    346-43-122-41-013000

    Datasheet

    346 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-640-41-001101

    116-83-640-41-001101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-640-41-001101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-640-TL-I

    ICF-640-TL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    0
    RFQ
    ICF-640-TL-I

    Datasheet

    ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    510-87-196-14-000101

    510-87-196-14-000101

    CONN SOCKET PGA 196POS GOLD

    Preci-Dip

    0
    RFQ
    510-87-196-14-000101

    Datasheet

    510 Bulk Active PGA 196 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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